Incure GapFill™ D99 Thermal Cycling Resistant Adhesive for High Temp

Incure GapFill™ D99 is a medium-viscosity black adhesive formulated to resist thermal cycling and humidity. D99 is ideal for bonding a variety of materials, including most metals, plastics, and rubbers, in environments with fluctuating temperatures. It can withstand continuous temperatures up to 100°C and intermittent temperatures up to 120°C, making it a reliable choice for challenging applications.

Key Features:

• Thermal Cycling Resistance: Maintains bond integrity through temperature fluctuations.
• Humidity Resistant: Provides a durable bond in humid environments.
• High Temperature Performance: Withstands temperatures up to 120°C intermittently.
• Medium Viscosity: Fills gaps up to 0.25 mm.
• Color: Black