Incure Pyra-Sil™ 905 Low-Viscosity UV Cure Silicone for PCB and Electronic Components

Incure Pyra-Sil™ 905 is a low-viscosity, UV/moisture-cure silicone adhesive designed for PCBA and electronic components. It provides fast curing under UV light, and its secondary moisture cure ensures that shadowed areas are fully sealed and protected.

Key Features:

• • Low Viscosity: 600 cP for flow into small gaps and tight areas.
  • UV/Moisture Cure: Fast curing with complete protection in shadowed areas.
  • High-Temperature Resistance: Withstands temperatures up to 260°C.
  • Clear Finish: Dries clear for an invisible protective layer.
  • Strong Bond: Tensile strength of 100 psi.
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