Incure Epo-Weld™ 5140 Fast-Cure Epoxy for Flip-Chip and Electronic Device Packaging – 10ml / 30ml

Incure Epo-Weld™ 5140 is a one-component epoxy adhesive for rework and electronic devices. It offers a fast cure at high temperature and develops tough, strong structural bonds with excellent shear, peel, and impact strength. It is well-suited for the flip-chip underfill packaging process, as it can quickly fill the gap between the wafer and the complete package.

Key Features:

• • Fast Cure at High Temp: Reduces working time.
  • Flip-Chip Underfill: Specifically suited for this packaging process.
  • High Strength: Provides tough, strong structural bonds.
  • High Durability: Passes many environmental tests.
  • Color: Black.
  • Pot Life: 3-5 days.