INCURE
Incure Uni-Weld™ 1465 Tack-Free High-Strength Bonder for Optical Devices
Incure Uni-Weld™ 1465 Tack-Free High-Strength Bonder for Optical Devices
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Incure Uni-Weld™ 1465 is a high-performance structural adhesive designed for precision bonding in electronics assembly, specifically targeting applications requiring robust vibration resistance.
This advanced formulation utilizes a rapid light-curing mechanism to freeze components instantly in place. The material effectively prevents fatigue failure in solder joints and wire tacking applications by distributing stress loads evenly across the bond line. Engineered to withstand harsh environments, it exhibits exceptional durability against moisture ingress, chemical exposure, and thermal cycling extremes.
Ideally suited for component staking and wire tacking, this adhesive allows for higher throughput on automated assembly lines while ensuring long-term reliability.
Technical Data Sheet
Technical Data Sheet
Shelf-Life, Storage, Use and Handling
Shelf-Life, Storage, Use and Handling
Shelf-Life of this unopened product is a minimum of 12 from date of manufacture. Avoid direct exposure of bottle to visible light at all times.
Containers should remained covered when not in use. Product should be stored in a dark cool place of 10°C to 32°C. Transfer of product into other packages void all warranties.
Users should ensure all bonding surfaces are free of grease, mold release, or any contaminants, as bonding performance will be compromised. All tests for cured bonds should be carried out at ambient temperature.
For safe handling of this product, please read Material Safety Data-sheet (MSDS) prior to use.
Leadtime
Leadtime
2 to 4 weeks ARO
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