Incure Uni-Weld™ 1465 Tack-Free High-Strength Bonder for Optical Devices

Incure Uni-Weld™ 1465 is a superior industrial-grade bonder that cures tack-free, offering exceptional performance on metals, glass, ceramics, and other high-strength multi-substrates. Its very low shrinkage property makes it ideal for applications in positioning optics and devices where minimal drift is required. The slight translucent finish ensures a clean and precise bond.

Key Features:

• Substrates: High Strength Multi-Substrates

• Color: Slight Translucent

• Viscosity: 6,000 cP

• Tensile (psi): 5,400

• Hardness: D60-D70

• Elongation: 105%

• Highlights: Cures tack-free, superior bonder for multi-substrates, ideal for positioning optics and devices, very low shrinkage