Incure GapFill™ D98 Thermal Cycling Resistant Adhesive for High-Stress Bonds – 20g / 500g

Incure GapFill™ D98 is a clear, medium-viscosity adhesive designed to withstand thermal cycling. Its unique formulation provides a strong, durable bond that maintains its integrity through repeated temperature fluctuations, making it ideal for applications in electronics, automotive, and other industries where thermal stress is a concern.

Key Features:

• Thermal Cycling Resistant: Maintains bond strength through temperature changes.
• High Strength: Shear strength of 3,000 psi.
• Fast Curing: Fixtures in 50 seconds.
• Clear Finish: Dries clear for a professional, clean appearance.