Incure Epo-Weld™ 6429 High-Tg, High-Viscosity Epoxy for Electronic Device Bonding

Incure Epo-Weld™ 6429 is a high-viscosity, high-Tg two-part epoxy adhesive for electronic device bonding. An elevated temperature post-cure is necessary to obtain maximum high-temperature stability and optimum properties. This adhesive provides a strong and reliable bond for critical electronic components.

Key Features:

• Application: Electronic device bonding
• Color: Part A – Light Grey, Part B – Brown
• Viscosity (cP): Part A – 186,000–435,000, Part B – 58,800–137,500
• Hardness: D90
• Pot Life: 30 mins