Incure Uni-Weld™ 1013 High-Strength Industrial Bonder for Ultem & PVC

Incure Uni-Weld™ 1013 is a high-performance structural urethane acrylate designed for the ruggedization of electronic assemblies and high-speed component staking. Capable of replacing slow-curing thermal epoxies.

This formulation cures instantly under UV light to lock heavy components, wires, and connectors in place against shock and vibration. It prevents fatigue failure in delicate solder joints by distributing mechanical stress across the bonded area, ensuring survival during aggressive drop tests and tumble cycling. The material offers exceptional durability, resisting moisture ingress, chemical attack from cleaning solvents, and thermal shock from rapid operational cycling.

Ideally suited for wire tacking on PCBs and corner bonding of BGA chips.