Incure Uni-Seal™ 3718F Flexible Encapsulant for Electronics with Secondary Heat Cure

Incure Uni-Seal™ 3718F is a flexible encapsulant designed for electronic devices. It cures in seconds with a secondary heat cure option for hidden areas, ensuring a complete and reliable bond. This highly viscous, slightly translucent material bonds to many different substrates, providing a protective and flexible layer for various electronic applications.

Key Features:

• Substrates: Multi-Substrates

• Color: Slightly Translucent

• Viscosity: 14,000 cP

• Tensile (psi): 2,400-5,200

• Hardness: D40-D50

• Elongation: 254%

• Highlights: Flexible encapsulant, cures in seconds, secondary heat cure option for hidden areas, bonds to many different substrates