INCURE
Incure Uni-Seal™ 3718F Flexible Encapsulant for Electronics with Secondary Heat Cure
Incure Uni-Seal™ 3718F Flexible Encapsulant for Electronics with Secondary Heat Cure
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Incure Uni-Seal™ 3718F is a flexible encapsulant designed for electronic devices. It cures in seconds with a secondary heat cure option for hidden areas, ensuring a complete and reliable bond. This highly viscous, slightly translucent material bonds to many different substrates, providing a protective and flexible layer for various electronic applications.
Key Features:
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Substrates: Multi-Substrates
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Color: Slightly Translucent
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Viscosity: 14,000 cP
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Tensile (psi): 2,400-5,200
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Hardness: D40-D50
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Elongation: 254%
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Highlights: Flexible encapsulant, cures in seconds, secondary heat cure option for hidden areas, bonds to many different substrates
Technical Data Sheet
Technical Data Sheet
Shelf-Life, Storage, Use and Handling
Shelf-Life, Storage, Use and Handling
Shelf-Life of this unopened product is a minimum of 12 from date of manufacture. Avoid direct exposure of bottle to visible light at all times.
Containers should remained covered when not in use. Product should be stored in a dark cool place of 10°C to 32°C. Transfer of product into other packages void all warranties.
Users should ensure all bonding surfaces are free of grease, mold release, or any contaminants, as bonding performance will be compromised. All tests for cured bonds should be carried out at ambient temperature.
For safe handling of this product, please read Material Safety Data-sheet (MSDS) prior to use.
Leadtime
Leadtime
2 to 4 weeks ARO
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