Incure Encap™ 3555 Ultra-Low Stress Encapsulant for Electronics

Incure Encap™ 3555 is an ultra-low stress, clear encapsulant specifically engineered for electronic components. It offers fast curing and excellent light transmission properties, making it ideal for applications where optical clarity is crucial. This encapsulant provides enhanced moisture and temperature resistance and does not attack flexible circuits, ensuring the long-term reliability and integrity of your electronic assemblies.

Key Features:

• Substrates: Multi-Substrates (Low Adhesion)
• Viscosity (cP): 20
• Tensile (psi): 4,150
• Hardness: D63–D73
• Elongation: 32%
• Highlights: Ultra-low stress, fast curing, high light transmission, enhanced moisture and temperature resistance, and does not attack flexible circuits.