INCURE
Incure Uni-Weld™ 1832 Low-Viscosity UV-Curing Bonder for Dissimilar Substrates
Incure Uni-Weld™ 1832 Low-Viscosity UV-Curing Bonder for Dissimilar Substrates
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Incure Uni-Weld™ 1832 is a high-performance structural adhesive designed for robust bonding in the electronics and general assembly industries. Replacing slow thermal curing epoxies, this urethane acrylate system cures instantly under UV light to lock components in place. It effectively prevents fatigue failure in solder joints and wire tacks by absorbing vibration and impact energy.
The material exhibits exceptional durability against moisture, thermal shock, and chemical exposure, ensuring long-term reliability in harsh environments.
Ideally suited for wire tacking and component staking, it allows for higher throughput on automated high-speed assembly lines.
Technical Data Sheet
Technical Data Sheet
Shelf-Life, Storage, Use and Handling
Shelf-Life, Storage, Use and Handling
Shelf-Life of this unopened product is a minimum of 12 from date of manufacture. Avoid direct exposure of bottle to visible light at all times.
Containers should remained covered when not in use. Product should be stored in a dark cool place of 10°C to 32°C. Transfer of product into other packages void all warranties.
Users should ensure all bonding surfaces are free of grease, mold release, or any contaminants, as bonding performance will be compromised. All tests for cured bonds should be carried out at ambient temperature.
For safe handling of this product, please read Material Safety Data-sheet (MSDS) prior to use.
Leadtime
Leadtime
2 to 4 weeks ARO
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