INCURE
Incure Uni-Weld™ 1063 Low Viscosity Clear Multi-Substrate Plastic Bonder
Incure Uni-Weld™ 1063 Low Viscosity Clear Multi-Substrate Plastic Bonder
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Incure Uni-Weld™ 1063 is a resilient, self-leveling urethane acrylate designed for high-stress bonding in general industry and electronics.
This flowable formulation utilizes a high-energy free radical curing mechanism, replacing slow thermal curing processes and eliminating mechanical fasteners in high-speed assembly lines. The material is specifically engineered to prevent fatigue failure, substrate cracking, and vibrational loosening in bonded assemblies. It demonstrates exceptional durability against environmental threats, including high humidity, thermal shock cycling, and chemical exposure.
Ideal for doming, potting, and glass assembly, this adhesive ensures deep cure and bubble-free encapsulation for higher throughput.
Technical Data Sheet
Technical Data Sheet
Shelf-Life, Storage, Use and Handling
Shelf-Life, Storage, Use and Handling
Shelf-Life of this unopened product is a minimum of 12 from date of manufacture. Avoid direct exposure of bottle to visible light at all times.
Containers should remained covered when not in use. Product should be stored in a dark cool place of 10°C to 32°C. Transfer of product into other packages void all warranties.
Users should ensure all bonding surfaces are free of grease, mold release, or any contaminants, as bonding performance will be compromised. All tests for cured bonds should be carried out at ambient temperature.
For safe handling of this product, please read Material Safety Data-sheet (MSDS) prior to use.
Leadtime
Leadtime
2 to 4 weeks ARO
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